Patent Assignment
Reel/Frame 044019/0021
Assignment of Assignor's Interest
Recorded: 2017-11-02
Pages: 6
Assignors
TAI, CHIH-HSUAN
Executed: 2017-08-08
KUO, TING-TING
Executed: 2017-08-08
HUANG, YU-CHIH
Executed: 2017-08-08
LIN, CHIH-WEI
Executed: 2017-08-08
LIN, HSIU-JEN
Executed: 2017-08-08
CHEN, CHIH-HUA
Executed: 2017-08-08
CHENG, MING-DA
Executed: 2017-10-08
HSIEH, CHING-HUA
Executed: 2017-08-08
TSAI, HAO-YI
Executed: 2017-08-08
LIU, CHUNG-SHI
Executed: 2017-08-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Package Structure and Method of Forming Package Structure