Patent Assignment
Reel/Frame 044019/0863
Assignment of Assignor's Interest
Recorded: 2017-11-02
Pages: 7
Assignors
SAFRAN, JOHN M.
Executed: 2016-11-28
NXUMALO, JOCHONIA N.
Executed: 2016-11-28
LIU, JOYCE C.
Executed: 2016-11-30
ROSENBLATT, SAMI
Executed: 2016-11-30
KOTHANDARAMAN, CHANDRASEKHARAN
Executed: 2016-12-01
Assignee
GLOBALFOUNDRIES INC.
PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property
(1)
Through-Silicon via with Improved Substrate Contact for Reduced Through-Silicon via (Tsv) Capacitance Variability
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Assignment of Assignor's Interest
Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →