Patent Assignment
Reel/Frame 044020/0170
Assignment of Assignor's Interest
Recorded: 2017-11-02
Pages: 4
Assignors
AOKI, TOYOHIRO
Executed: 2017-10-18
HISADA, TAKASHI
Executed: 2017-10-18
NAKAMURA, EIJI
Executed: 2017-10-18
TOKUNARI, MASAO
Executed: 2017-10-19
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Fabrication Method of High Aspect Ratio Solder Bumping with Stud Bump and Injection Molded Solder, and Flip Chip Joining with the Solder Bump