IP Library › Assignment 044075/0980
Patent Assignment
Reel/Frame 044075/0980

Assignment of Assignor's Interest

Recorded: 2017-11-08 Pages: 4
Assignors
DELACRUZ, JAVIER A.
Executed: 2017-10-27
TEIG, STEVEN L.
Executed: 2017-10-27
HUANG, SHAOWU
Executed: 2017-10-27
PLANTS, WILLIAM C.
Executed: 2017-10-27
FISCH, DAVID EDWARD
Executed: 2017-10-26
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Direct-Bonded Native Interconnects and Active Base Die
Application: 15/725,030 →
Publication: US 2018/0102251
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 23, 2018
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: XCELSIS CORPORATION
Reel/Frame 045336/0086 →
Change of Name Sep 23, 2024
From: XCELSIS CORPORATION
To: ADEIA SEMICONDUCTOR INC.
Reel/Frame 069015/0766 →