IP Library › Assignment 069015/0766
Patent Assignment
Reel/Frame 069015/0766

Change of Name

Recorded: 2024-09-23 Pages: 5
Assignor
XCELSIS CORPORATION
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (14)
Direct-Bonded Native Interconnects and Active Base Die
Application: 15/725,030 →
Publication: US 2018/0102251
Self Healing Compute Array
Application: 15/849,468 →
Publication: US 2018/0173600
Face-to-Face Mounted IC Dies with Orthogonal Top Interconnect Layers
Application: 15/976,811 →
Publication: US 2018/0331072
3D Compute Circuit with High Density Z-Axis Interconnects
Application: 16/159,703 →
Publication: US 2019/0123022
3D Compute Circuit with High Density Z-Axis Interconnects
Application: 16/159,704 →
Publication: US 2019/0123023
3D Processor
Application: 16/159,705 →
Publication: US 2019/0123024
Stacked Architecture for Three-Dimensional Nand
Application: 16/523,222 →
Publication: US 2020/0203316
Direct-Bonded Native Interconnects and Active Base Die
Application: 16/730,220 →
Publication: US 2020/0194262
Face-to-Face Mounted IC Dies with Orthogonal Top Interconnect Layers
Application: 16/806,854 →
Publication: US 2020/0203318
3D Processor Having Stacked Integrated Circuit Die
Application: 16/833,341 →
Publication: US 2020/0227389
Direct-Bonded Native Interconnects And Active Base Die
Application: 16/944,823 →
Publication: US 2020/0357641
3D Chip Sharing Data Bus
Application: 17/105,272 →
Publication: US 2021/0202445
3D Processor Having Stacked Integrated Circuit Die
Application: 17/474,917 →
Publication: US 2022/0068890
Stacked Architecture for Three-Dimensional Nand
Application: 17/892,964 →
Publication: US 2023/0050150
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 8, 2017
From: DELACRUZ, JAVIER A.; TEIG, STEVEN L.; HUANG, SHAOWU; PLANTS, WILLIAM C.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 044075/0980 →
Assignment of Assignor's Interest Jan 16, 2018
From: DELACRUZ, JAVIER A.; TEIG, STEVEN L.; FISCH, DAVID EDWARD; PLANTS, WILLIAM C.
To: INVENSAS CORPORATION
Reel/Frame 044631/0314 →
Assignment of Assignor's Interest Mar 23, 2018
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: XCELSIS CORPORATION
Reel/Frame 045336/0086 →
Assignment of Assignor's Interest Mar 23, 2018
From: INVENSAS CORPORATION
To: XCELSIS CORPORATION
Reel/Frame 045335/0947 →
Assignment of Assignor's Interest Oct 27, 2018
From: NEQUIST, ERIC M.; TEIG, STEVEN L.; DELACRUZ, JAVIER; MOHAMMED, ILYAS
To: XCELSIS CORPORATION
Reel/Frame 047333/0629 →
Assignment of Assignor's Interest Jan 9, 2019
From: TEIG, STEVEN L.; MOHAMMED, ILYAS; DUONG, KENNETH; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 047945/0591 →
Assignment of Assignor's Interest Jan 9, 2019
From: TEIG, STEVEN L.; MOHAMMED, ILYAS; DUONG, KENNETH; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 047945/0392 →
Assignment of Assignor's Interest Jan 14, 2019
From: TEIG, STEVEN L.; MOHAMMED, ILYAS; DUONG, KENNETH; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 047988/0918 →
Assignment of Assignor's Interest Oct 22, 2019
From: MOREIN, STEPHEN; DELACRUZ, JAVIER A.; CHANG, XU; HABA, BELGACEM
To: XCELSIS CORPORATION
Reel/Frame 050795/0811 →
Assignment of Assignor's Interest Jan 21, 2020
From: DELACRUZ, JAVIER A.; TEIG, STEVEN L.; HUANG, SHAOWU; PLANTS, WILLIAM C.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 051568/0937 →
Assignment of Assignor's Interest Jan 21, 2020
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: XCELSIS CORPORATION
Reel/Frame 051569/0032 →
Assignment of Assignor's Interest Mar 2, 2020
From: NEQUIST, ERIC M.; TEIG, STEVEN L.; DELACRUZ, JAVIER; MOHAMMED, ILYAS
To: XCELSIS CORPORATION
Reel/Frame 051983/0847 →
Assignment of Assignor's Interest Aug 5, 2020
From: DELACRUZ, JAVIER A.; TEIG, STEVEN L.; HUANG, SHAOWU; PLANTS, WILLIAM C.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 053408/0730 →
Assignment of Assignor's Interest Aug 6, 2020
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: XCELSIS CORPORATION
Reel/Frame 053418/0613 →
Assignment of Assignor's Interest Dec 21, 2020
From: DELACRUZ, JAVIER A.; TEIG, STEVEN L.; MOHAMMED, ILYAS
To: XCELSIS CORPORATION
Reel/Frame 054709/0111 →
Assignment of Assignor's Interest Jan 22, 2021
From: TEIG, STEVEN L.; MOHAMMED, ILYAS; DUONG, KENNETH; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 055001/0963 →
Assignment of Assignor's Interest Sep 17, 2021
From: TEIG, STEVEN L.; MOHAMMED, ILYAS; DUONG, KENNETH; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 057511/0531 →
Assignment of Assignor's Interest Aug 22, 2022
From: MOREIN, STEPHEN; DELACRUZ, JAVIER A.; CHANG, XU; HABA, BELGACEM
To: XCELSIS CORPORATION
Reel/Frame 060862/0143 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name Sep 10, 2024
From: XCELSIS CORPORATION
To: ADEIA SEMICONDUCTOR INC.
Reel/Frame 068922/0628 →