IP Library › Assignment 051568/0937
Patent Assignment
Reel/Frame 051568/0937

Assignment of Assignor's Interest

Recorded: 2020-01-21 Pages: 4
Assignors
DELACRUZ, JAVIER A.
Executed: 2017-10-27
TEIG, STEVEN L.
Executed: 2017-10-27
HUANG, SHAOWU
Executed: 2017-10-27
PLANTS, WILLIAM C.
Executed: 2017-10-27
FISCH, DAVID EDWARD
Executed: 2017-10-26
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PKWY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Direct-Bonded Native Interconnects and Active Base Die
Application: 16/730,220 →
Publication: US 2020/0194262
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 21, 2020
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: XCELSIS CORPORATION
Reel/Frame 051569/0032 →
Change of Name Sep 23, 2024
From: XCELSIS CORPORATION
To: ADEIA SEMICONDUCTOR INC.
Reel/Frame 069015/0766 →