IP Library › Assignment 051569/0032
Patent Assignment
Reel/Frame 051569/0032

Assignment of Assignor's Interest

Recorded: 2020-01-21 Pages: 4
Assignor
Assignee
XCELSIS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Direct-Bonded Native Interconnects and Active Base Die
Application: 16/730,220 →
Publication: US 2020/0194262
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 21, 2020
From: DELACRUZ, JAVIER A.; TEIG, STEVEN L.; HUANG, SHAOWU; PLANTS, WILLIAM C.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 051568/0937 →
Change of Name Sep 23, 2024
From: XCELSIS CORPORATION
To: ADEIA SEMICONDUCTOR INC.
Reel/Frame 069015/0766 →