Patent Assignment
Reel/Frame 057511/0531
Assignment of Assignor's Interest
Recorded: 2021-09-17
Pages: 3
Assignors
TEIG, STEVEN L.
Executed: 2019-01-08
MOHAMMED, ILYAS
Executed: 2019-01-08
DUONG, KENNETH
Executed: 2019-01-08
DELACRUZ, JAVIER
Executed: 2019-01-08
Assignee
XCELSIS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
3D Processor Having Stacked Integrated Circuit Die
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name
Sep 10, 2024
From: XCELSIS CORPORATION
To: ADEIA SEMICONDUCTOR INC.
Reel/Frame 068922/0628 →
Change of Name
Sep 23, 2024
From: XCELSIS CORPORATION
To: ADEIA SEMICONDUCTOR INC.
Reel/Frame 069015/0766 →