Patent Assignment
Reel/Frame 068922/0628
Change of Name
Recorded: 2024-09-10
Pages: 5
Assignor
XCELSIS CORPORATION
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(5)
3D Compute Circuit with High Density Z-Axis Interconnects
3D Compute Circuit with High Density Z-Axis Interconnects
3D Processor
3D Processor Having Stacked Integrated Circuit Die
3D Processor Having Stacked Integrated Circuit Die
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 9, 2019
From: TEIG, STEVEN L.; MOHAMMED, ILYAS; DUONG, KENNETH; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 047945/0392 →
Assignment of Assignor's Interest
Jan 9, 2019
From: TEIG, STEVEN L.; MOHAMMED, ILYAS; DUONG, KENNETH; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 047945/0591 →
Assignment of Assignor's Interest
Jan 14, 2019
From: TEIG, STEVEN L.; MOHAMMED, ILYAS; DUONG, KENNETH; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 047988/0918 →
Assignment of Assignor's Interest
Jan 22, 2021
From: TEIG, STEVEN L.; MOHAMMED, ILYAS; DUONG, KENNETH; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 055001/0963 →
Assignment of Assignor's Interest
Sep 17, 2021
From: TEIG, STEVEN L.; MOHAMMED, ILYAS; DUONG, KENNETH; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 057511/0531 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name
Sep 23, 2024
From: XCELSIS CORPORATION
To: ADEIA SEMICONDUCTOR INC.
Reel/Frame 069015/0766 →