Patent Assignment
Reel/Frame 055001/0963
Assignment of Assignor's Interest
Recorded: 2021-01-22
Pages: 3
Assignors
TEIG, STEVEN L.
Executed: 2019-01-08
MOHAMMED, ILYAS
Executed: 2019-01-08
DUONG, KENNETH
Executed: 2019-01-08
DELACRUZ, JAVIER
Executed: 2019-01-08
Assignee
XCELSIS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
3D Processor Having Stacked Integrated Circuit Die
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.