IP Library › Assignment 045336/0086
Patent Assignment
Reel/Frame 045336/0086

Assignment of Assignor's Interest

Recorded: 2018-03-23 Pages: 4
Assignor
Assignee
XCELSIS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (2)
Direct-Bonded Native Interconnects and Active Base Die
Application: 15/725,030 →
Publication: US 2018/0102251
Native Inter-Die Interconnect
Application: 62/405,833 →
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 20, 2016
From: DELACRUZ, JAVIER A.; TEIG, STEVEN L.; HUANG, SHAOWU
To: ZIPTRONIX, INC.
Reel/Frame 040697/0050 →
Change of Name Jun 28, 2017
From: ZIPTRONIX , INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 043029/0657 →
Assignment of Assignor's Interest Nov 8, 2017
From: DELACRUZ, JAVIER A.; TEIG, STEVEN L.; HUANG, SHAOWU; PLANTS, WILLIAM C.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 044075/0980 →
Change of Name Sep 23, 2024
From: XCELSIS CORPORATION
To: ADEIA SEMICONDUCTOR INC.
Reel/Frame 069015/0766 →