Patent Assignment
Reel/Frame 044087/0023
Assignment of Assignor's Interest
Recorded: 2017-11-09
Pages: 3
Assignors
., ANTONIO BAMBALAN DIMAANO JR.
Executed: 2017-10-24
ROBLES, ROEL ADEVA
Executed: 2017-10-24
Assignee
UTAC HEADQUARTERS PTE. LTD.
22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Property
(1)
Multi-Layer Leadless Semiconductor Package and Method of Manufacturing the Same