Patent Assignment
Reel/Frame 044121/0097
Assignment of Assignor's Interest
Recorded: 2017-11-14
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Post-Passivation Interconnect Structure and Methods Thereof