Patent Assignment
Reel/Frame 044122/0198
Assignment of Assignor's Interest
Recorded: 2017-11-14
Pages: 4
Assignor
YOON, SANG WON
Executed: 2017-11-14
Assignee
INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
222, WANGSIMNI-RO, SEONGDONG-GU, SEOUL, 04763, KOREA, REPUBLIC OF
Covered Property
(1)
Sensor Packaging Using a Low-Temperature Through-Silicon via (Tsv) Technology and Method for Manufacturing the Same