IP Library › Assignment 044124/0644
Patent Assignment
Reel/Frame 044124/0644

Assignment of Assignor's Interest

Recorded: 2017-11-14 Pages: 5
Assignors
LEE, DONG HOON
Executed: 2014-07-04
KIM, DO HYUNG
Executed: 2014-07-02
HAN, SEUNG CHUL
Executed: 2014-07-04
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Device with Thin Redistribution Layers
Application: 15/812,741 →
Publication: US 2018/0068966
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →