Patent Assignment
Reel/Frame 044132/0079
Assignment of Assignor's Interest
Recorded: 2017-11-15
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2017-10-17
TSENG, MING HUNG
Executed: 2017-10-11
LIN, YEN-LIANG
Executed: 2017-10-11
HUANG, TZU-SUNG
Executed: 2017-10-11
KUO, TIN-HAO
Executed: 2017-10-11
TSAI, HAO-YI
Executed: 2017-10-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages and Methods of Forming the Same