Patent Assignment
Reel/Frame 044155/0515
Assignment of Assignor's Interest
Recorded: 2017-11-16
Pages: 7
Assignor
QUALCOMM INCORPORATED
Executed: 2017-08-23
Assignee
OBSIDIAN SENSORS, INC.
4250 EXECUTIVE SQUARE, 2ND FLOOR, SAN DIEGO, CALIFORNIA, 92037
Covered Properties
(4)
Thermomechanical Device for Measuring Electromagnetic Radiation
Integrated Packaging Devices and Methods with Backside Interconnections
Panel Level Packaging for Mems Application
Wafer Level Integrated Optics in Packaging for Imaging Sensor Application
Application:
15/625,089 →
Publication:
US 2018/0364439
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 26, 2016
From: CHAN, EDWARD; WEN, BING
To: QUALCOMM INCORPORATED
Reel/Frame 039555/0667 →
Assignment of Assignor's Interest
Apr 5, 2017
From: PAN, YAOLING; CHANG, TALLIS YOUNG; HONG, JOHN HYUNCHUL
To: QUALCOMM INCORPORATED
Reel/Frame 041859/0244 →
Assignment of Assignor's Interest
Apr 27, 2017
From: PAN, YAOLING; BCHIR, OMAR
To: QUALCOMM INCORPORATED
Reel/Frame 042160/0168 →
Assignment of Assignor's Interest
Dec 7, 2017
From: PAN, YAOLING; MA, JIAN; HONG, JOHN; CHANG, TALLIS
To: QUALCOMM INCORPORATED
Reel/Frame 044334/0722 →