Assignment of Assignor's Interest

Recorded: 2017-12-07 Pages: 14

Assignors

PAN, YAOLING

Executed: 2017-08-31

MA, JIAN

Executed: 2017-09-07

HONG, JOHN

Executed: 2017-08-22

CHANG, TALLIS

Executed: 2017-08-23

Assignee

QUALCOMM INCORPORATED

5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714

Covered Property (1)

Wafer Level Integrated Optics in Packaging for Imaging Sensor Application

Application: 15/625,089 →

Publication: US 2018/0364439

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.