Patent Assignment
Reel/Frame 044163/0779
Assignment of Assignor's Interest
Recorded: 2017-11-17
Pages: 4
Assignors
KIM, SEUNG WAN
Executed: 2017-10-10
JANG, DEOK SUK
Executed: 2017-10-10
YEO, JEONG HO
Executed: 2017-10-10
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Reducing Warpage of Semiconductor Package Substrate and Device for Reducing Warpage
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.