IP Library Assignment 044170/0639
Patent Assignment
Reel/Frame 044170/0639

Assignment of Assignor's Interest

Recorded: 2017-11-20 Pages: 20
Assignors
BONILLA, GRISELDA
Executed: 2016-01-28
CHOI, SAMUEL S.
Executed: 2016-01-18
FILIPPI, RONALD G.
Executed: 2016-01-19
HUANG, ELBERT E.
Executed: 2016-01-22
LUSTIG, NAFTALI E.
Executed: 2016-01-17
SIMON, ANDREW H.
Executed: 2016-01-22
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Interconnect Structure Having Subtractive Etch Feature and Damascene Feature
Application: 15/816,508 →
Publication: US 2018/0076133
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name Nov 21, 2025
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 073658/0439 →
Change of Name Nov 21, 2025
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 073658/0823 →