Patent Assignment
Reel/Frame 044190/0588
Assignment of Assignor's Interest
Recorded: 2017-11-21
Pages: 8
Assignors
THANU, DINESH P.R.
Executed: 2017-10-17
DHAVALESWARAPU, HEMANTH K.
Executed: 2017-10-17
BEATTY, JOHN J.
Executed: 2017-10-17
JAIN, SYADWAD
Executed: 2017-10-17
RARAVIKAR, NACHIKET R.
Executed: 2017-10-24
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Heat Spreader Edge Standoffs for Managing Bondline Thickness in Microelectronic Packages