Heat spreader edge standoffs for managing bondline thickness in microelectronic packages
A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.
1. A microelectronic package, comprising:
a microelectronic substrate having a first surface;
at least one microelectronic device having an active surface and a back surface, wherein the microelectronic device active surface is electrically attached to the microelectronic substrate first surface;
a heat dissipation device, including a planar portion having a first surface and an opposing second surface, and at least one projection extending from the second surface of planar portion, wherein the at least one projection includes an attachment surface and wherein the second surface of the planar portion of the heat dissipation device is in thermal contact with the back surface of the at least one microelectronic device;
at least two standoffs extending from the attachment surface of the at least one projection, wherein the at least two standoffs contact the microelectronic substrate and wherein the at least two standoffs each comprise a structure separate from the heat dissipation device and a different material from the heat dissipation device; and
a sealant disposed between the microelectronic substrate and the at least one projection, wherein the sealant contacts the substrate, the attachment surface of the at least one projection, and the at least two standoffs and wherein the sealant has a uniform bond line thickness, defined between the substrate and the attachment surface of the at least one projection, that extends an entire distance between the at least two standoffs.
2. The microelectronic package of claim 1 , wherein the attachment surface is substantially parallel to the microelectronic substrate first surface.
3. The microelectronic package of claim 1 , wherein the at least one heat dissipation device projection includes a lip portion having the attachment surface.
4. The microelectronic package of claim 3 , wherein the attachment surface is substantially parallel to the microelectronic substrate first surface.
5. The microelectronic package of claim 1 , further including a thermal interface material disposed between the second surface of the planar portion of the heat dissipation device and the back surface of the at least one microelectronic device.
6. An electronic system, comprising:
a board; and
a microelectronic package attached to the board, wherein the microelectronic package includes:
a microelectronic substrate having a first surface;
at least one microelectronic device having an active surface and a back surface, wherein the microelectronic device active surface of the at least one microelectronic device is electrically attached to the microelectronic substrate first surface;
a heat dissipation device, including a planar portion having a first surface and an opposing second surface, and at least one projection extending from the second surface of planar portion, wherein the at least one projection includes an attachment surface and wherein the second surface of the planar portion of the heat dissipation device is in thermal contact with the back surface of the at least one microelectronic device;
at least two standoffs extending from the attachment surface of the at least one projection, wherein the at least two standoffs contact the microelectronic substrate and wherein the at least two standoffs each comprise a structure separate from the heat dissipation device and a different material from the heat dissipation device; and
a sealant disposed between the microelectronic substrate and the at least one projection, wherein the sealant contacts the substrate, the attachment surface of the at least one projection, and the at least two standoffs and wherein the sealant material has a uniform bond line thickness, defined between the substrate and the attachment surface of the at least one projection, that extends the entire distance between the at least two standoffs.
7. The electronic system of claim 6 , wherein the at least one heat dissipation device projection includes a lip portion having the attachment surface.
8. The electronic system of claim 6 , further including a thermal interface material disposed between the second surface of the planar portion of the heat dissipation device and the back surface of the at least one microelectronic device.
9. The electronic system of claim 6 , wherein the attachment surface is substantially parallel to the microelectronic substrate first surface.
10. The electronic system of claim 7 , wherein the attachment surface is substantially parallel to the microelectronic substrate first surface.