Patent Assignment
Reel/Frame 044197/0612
Assignment of Assignor's Interest
Recorded: 2017-11-22
Pages: 4
Assignors
LIANG, JIM SHIH-CHUN
Executed: 2017-11-21
OGINO, ATSUSHI
Executed: 2017-11-21
LONG, JUSTIN C.
Executed: 2017-11-21
Assignee
GLOBALFOUNDRIES INC.
P.O. BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property
(1)
Method to Reduce Resistance for a Copper (Cu) Interconnect Landing on Multilayered Metal Contacts, and Semiconductor Structures Formed Therefrom
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Assignment of Assignor's Interest
Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →