Patent Assignment
Reel/Frame 044221/0320
Assignment of Assignor's Interest
Recorded: 2017-11-27
Pages: 10
Assignors
CHIANG, YEN-TING
Executed: 2017-10-31
YAUNG, DUN-NIAN
Executed: 2017-10-31
TSENG, HSIAO-HUI
Executed: 2017-10-31
LIU, JEN-CHENG
Executed: 2017-10-31
WANG, YU-JEN
Executed: 2017-10-31
CHEN, CHUN-YUAN
Executed: 2017-10-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Back-Side Deep Trench Isolation (Bdti) Structure for Pinned Photodiode Image Sensor