Patent Assignment
Reel/Frame 044223/0021
Corrective Assignment to Correct the Assignor Name on the Assignment Document Previously Recorded at Reel: 019035 Frame: 0713. Assignor(S) Hereby Confirms the Assignment .
Recorded: 2017-10-18
Pages: 8
Assignor
CUNNINGHAM, JAMES A
Executed: 2005-03-04
Assignee
BECK SEMICONDUCTOR LLC
2215-B RENAISSANCE DRIVE, SUITE 5, LAS VEGAS, NEVADA, 89119
Covered Properties
(5)
Arrangement and Method for Improved Downward Scaling of Higher Conductivity Metal-Based Interconnects
Patent:
6,455,937 →
Application:
09/271,179 →
Method for Making Integrated Circuit Including Interconnects with Enhanced Electromigration Resistance
Patent:
6,521,532 →
Application:
09/619,587 →
Method for Making Integrated Circuit Including Interconnects with Enhanced Electromigration Resistance Using Doped Seed Layer and Integrated Circuits Produced Thereby
Patent:
6,551,872 →
Application:
09/642,140 →
Diffusion Barriers for Copper Interconnect Systems
Patent:
6,441,492 →
Application:
09/672,473 →
Copper Interconnect Systems Which Use Conductive, Metal-Based Cap Layers
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 3, 2020
From: INTELLECTUAL VENTURES I LLC
To: INTELLECTUAL VENTURES ASSETS 157 LLC
Reel/Frame 051411/0631 →
Assignment of Assignor's Interest
Jan 27, 2020
From: INTELLECTUAL VENTURES ASSETS 157 LLC
To: LIBERTY PATENTS LLC
Reel/Frame 051630/0115 →
Assignment of Assignor's Interest
Jan 27, 2020
From: INTELLECTUAL VENTURES ASSETS 157 LLC
To: LIBERTY PATENTS LLC
Reel/Frame 051632/0225 →
Assignment of Assignor's Interest
Jul 1, 2022
From: INTELLECTUAL VENTURES I LLC
To: INTELLECTUAL VENTURES ASSETS 185
Reel/Frame 060423/0937 →