Patent Assignment
Reel/Frame 060423/0937
Assignment of Assignor's Interest
Recorded: 2022-07-01
Pages: 6
Assignor
INTELLECTUAL VENTURES I LLC
Executed: 2022-06-29
Assignee
INTELLECTUAL VENTURES ASSETS 185
251 LITTLE FALLS DRIVE, WILMINGTON, DELAWARE, 19808
Covered Properties
(7)
Copper Interconnect Systems Which Use Conductive, Metal-Based Cap Layers
Copper Interconnect Systems
Copper Interconnect Systems Which Use Conductive, Metal-Based Cap Layers
Copper Interconnect Systems Which Use Conductive, Metal-Based Cap Layers
Methods of Manufacturing Copper Interconnect Systems
Methods of Manufacturing Copper Interconnect Systems
Application:
12/554,137 →
Publication:
US 2009/0321938
Methods of Manufacturing Copper Interconnect Systems
Application:
12/782,092 →
Publication:
US 2010/0224996
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Corrective Assignment to Correct the Assignor Name on the Assignment Document Previously Recorded at Reel: 019035 Frame: 0713. Assignor(S) Hereby Confirms the Assignment .
Oct 18, 2017
From: CUNNINGHAM, JAMES A
To: BECK SEMICONDUCTOR LLC
Reel/Frame 044223/0021 →
Corrective Assignment to Correct the Assignment Document Previously Recorded on Reel 022686 Frame 622. Assignor(S) Hereby Confirms the Assignment.
Dec 4, 2017
From: CUNNINGHAM, JAMES A
To: BECK SEMICONDUCTOR LLC
Reel/Frame 044680/0770 →
Corrective Assignment to Correct the Assignment Document Previously Recorded on Reel 019818 Frame 0394. Assignor(S) Hereby Confirms the Assignment.
Dec 4, 2017
From: CUNNINGHAM, JAMES A.
To: BECK SEMICONDUCTOR LLC
Reel/Frame 044681/0081 →