IP Library › Assignment 044232/0263
Patent Assignment
Reel/Frame 044232/0263

Assignment of Assignor's Interest

Recorded: 2017-11-28 Pages: 5
Assignors
LEE, KYOUNG YEON
Executed: 2013-11-01
KIM, BYONG JIN
Executed: 2013-11-01
BAE, JAE MIN
Executed: 2013-10-30
JEON, HYUNG IL
Executed: 2013-11-01
KIM, GI JEONG
Executed: 2013-11-01
CHUNG, JI YOUNG
Executed: 2013-11-01
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Land Structure for Semiconductor Package and Method Therefor
Application: 15/823,737 →
Publication: US 2018/0082932
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →