Patent Assignment
Reel/Frame 044276/0808
Assignment of Assignor's Interest
Recorded: 2017-12-01
Pages: 5
Assignors
LEE, CHANG BO
Executed: 2017-11-27
OH, JOON SEOK
Executed: 2017-11-27
JUNG, HYUN CHUL
Executed: 2017-11-27
YEO, JEONG HO
Executed: 2017-11-27
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package and Package Substrate Comprising the Same
Application:
15/829,045 →
Publication:
US 2019/0027419
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.