Patent Assignment
Reel/Frame 044311/0541
Assignment of Assignor's Interest
Recorded: 2017-12-06
Pages: 7
Assignors
KONDO, SHIGEKI
Executed: 2017-12-04
HATTORI, TAKAHIRO
Executed: 2017-12-04
KAWASAKI, HIROYOSHI
Executed: 2017-12-04
ROPPONGI, TAKAHIRO
Executed: 2017-12-04
SOMA, DAISUKE
Executed: 2017-12-04
SATO, ISAMU
Executed: 2017-12-04
Assignee
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
Covered Property
(1)
Core Material, Semiconductor Package, and Forming Method of Bump Electrode