Patent Assignment
Reel/Frame 044318/0328
Assignment of Assignor's Interest
Recorded: 2017-12-06
Pages: 7
Assignors
ST. GERMAIN, STEPHEN
Executed: 2014-09-09
ARBUTHNOT, ROGER M.
Executed: 2014-09-09
YODER, JAY A.
Executed: 2014-09-09
CONNER, DENNIS LEE
Executed: 2014-09-09
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Single or Multi Chip Module Package and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0494 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0494
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064159/0524 →