IP Library › Assignment 044334/0032
Patent Assignment
Reel/Frame 044334/0032

Assignment of Assignor's Interest

Recorded: 2017-12-07 Pages: 8
Assignors
YOKOYAMA, NANAE
Executed: 2017-12-05
SUZUKI, RYOTA
Executed: 2017-12-06
SATO, MAKOTO
Executed: 2017-12-07
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1-525, BOISE, IDAHO, 83716
Covered Property (1)
Apparatuses Having an Interconnect Extending from an Upper Conductive Structure, Through a Hole in Another Conductive Structure, and to an Underlying Structure
Application: 15/835,210 →
Publication: US 2019/0181053
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 7 to Patent Security Agreement Feb 6, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 045267/0833 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050716/0678 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →