Patent Assignment
Reel/Frame 044346/0996
Assignment of Assignor's Interest
Recorded: 2017-11-01
Pages: 3
Assignors
YU, CHEN-HUA
Executed: 2017-10-13
HUNG, WENSEN
Executed: 2017-10-13
CHEN, MING-FA
Executed: 2017-10-13
CHEN, TSUNG-YU
Executed: 2017-10-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Heat Spreading Device and Method