Patent Assignment
Reel/Frame 044374/0715
Assignment of Assignor's Interest
Recorded: 2017-12-12
Pages: 7
Assignors
LINDENBERG, TONY M.
Executed: 2017-12-12
BOSSART, KURT J.
Executed: 2017-12-12
HACKER, JONATHAN S.
Executed: 2017-12-12
TIWARI, CHANDRA S.
Executed: 2017-12-12
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 525, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Inductive Testing Probe Apparatus for Testing Semiconductor Die and Related Systems and Methods
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 7 to Patent Security Agreement
Feb 6, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 045267/0833 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050716/0678 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →