Patent Assignment
Reel/Frame 044397/0160
Assignment of Assignor's Interest
Recorded: 2017-12-14
Pages: 3
Assignors
SU, CHUN-YANG
Executed: 2017-12-12
WANG, JHAO-SHIN
Executed: 2017-12-12
YANG, NIAN-CIH
Executed: 2017-12-12
LO, XIN-WEI
Executed: 2017-12-12
Assignee
CHIPBOND TECHNOLOGY CORPORATION
NO.3, LIHSIN 5 RD., HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Chip Package Having a Flexible Substrate
Patent:
10,168,582 →
Application:
15/841,424 →