Chip package having a flexible substrate
A chip package includes a flexible substrate, a chip, a pressure-proof member and a reinforcement sheet. The chip and the pressure-proof member are located on a first surface of the flexible substrate, and the reinforcement sheet is located on a second surface of the flexible substrate. The pressure-proof member at least includes a pair of pressure-proof ribs which are located outside of the chip oppositely. The pressure-proof ribs located outside the chip can protect the chip from the damage caused by the pressure of other component (e.g. curved panel) except the chip package.
1. A chip package, comprising:
a flexible substrate including a first surface and a second surface;
a chip disposed on the first surface of the flexible substrate, the chip includes an active surface and a back surface, the active surface faces toward the first surface and is electrically connected to the flexible substrate, and a first height exists between the back surface of the chip and the first surface of the flexible substrate;
a reinforcement sheet connected to the second surface of the flexible substrate, a reinforcement region on the first surface of the flexible substrate is defined by a profile of the reinforcement sheet, and the chip is located within the reinforcement region; and
a preformed pressure-proof member disposed on the first surface of the flexible substrate including at least a pair of preformed pressure-proof ribs which are located outside of the chip oppositely and wholly within the reinforcement region, each of the preformed pressure-proof ribs includes a revealed surface and a connective surface opposite the revealed surface, the connective surface faces toward the first surface of the flexible substrate, and a second height exists between the revealed surface of the preformed pressure-proof rib and the first surface of the flexible substrate, wherein the second height is higher than the first height.
2. The chip package in accordance with claim 1 , wherein
the preformed pressure-proof member encircles the chip.
3. The chip package in accordance with claim 1 , wherein the preformed pressure-proof ribs are located outside the chip symmetrically.
4. The chip package in accordance with claim 1 , wherein the reinforcement sheet has rigidity greater than that of the flexible substrate.
5. The chip package in accordance with claim 1 , wherein the preformed pressure-proof member is made of polyimide (PI), polyethylene terephthalate (PET) or stainless steel (SUS).
6. The chip package in accordance with claim 1 , wherein the reinforcement sheet is connected to the second surface of the flexible substrate by an adhesive.
7. The chip package in accordance with claim 1 , wherein the connective surface of each preformed pressure-proof rib is connected to the first surface of the flexible substrate by an adhesive.