IP Library › Assignment 044397/0296
Patent Assignment
Reel/Frame 044397/0296

Assignment of Assignor's Interest

Recorded: 2017-12-14 Pages: 5
Assignors
YU, CHEN-HUA
Executed: 2017-08-15
WU, KAI-CHIANG
Executed: 2017-08-04
LIU, CHUNG-SHI
Executed: 2017-08-08
CHANG, SHOU-ZEN
Executed: 2017-09-11
SHIH, CHAO-WEN
Executed: 2017-08-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Integrated Devices in Semiconductor Packages and Methods of Forming Same
Application: 15/725,677 →
Publication: US 2018/0247905
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Fourth Inventors Name Previously Recorded at Reel: 044397 Frame: 0296. Assignor(S) Hereby Confirms the Assignment. Jan 4, 2021
From: YU, CHEN-HUA; WU, KAI-CHIANG; LIU, CHUNG-SHI; CHANG, SHOU ZEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 054892/0580 →