Corrective Assignment to Correct the Fourth Inventors Name Previously Recorded at Reel: 044397 Frame: 0296. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2021-01-04 Pages: 6

Assignors

YU, CHEN-HUA

Executed: 2017-08-15

WU, KAI-CHIANG

Executed: 2017-08-04

LIU, CHUNG-SHI

Executed: 2017-08-08

CHANG, SHOU ZEN

Executed: 2017-09-11

SHIH, CHAO-WEN

Executed: 2017-08-04

Assignee

8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN

Covered Property (1)

Integrated Devices in Semiconductor Packages and Methods of Forming Same

Patent: 10,354,964 →

Application: 15/725,677 →

Publication: US 2018/0247905

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.