Patent Assignment
Reel/Frame 044403/0793
Assignment of Assignor's Interest
Recorded: 2017-12-15
Pages: 3
Assignors
TRINH, HAI-DANG
Executed: 2017-11-28
LIN, HSING-LIEN
Executed: 2017-11-28
TSAI, CHENG-YUAN
Executed: 2017-11-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Memory Device with Diffusion Barrier and Capping Layer