Patent Assignment
Reel/Frame 044487/0218
Assignment of Assignor's Interest
Recorded: 2017-12-27
Pages: 6
Assignors
LIN, PO-YAO
Executed: 2017-12-15
HONG, CHENG-YI
Executed: 2017-12-19
HSU, FENG-CHENG
Executed: 2017-12-15
CHEN, SHUO-MAO
Executed: 2017-12-15
JENG, SHIN-PUU
Executed: 2017-12-15
YEH, SHU-SHEN
Executed: 2017-12-18
LEE, KUANG-CHUN
Executed: 2017-12-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semicondcutor Device Package and Method of Forming Semicondcutor Device Package