IP Library Assignment 044493/0322
Patent Assignment
Reel/Frame 044493/0322

Assignment of Assignor's Interest

Recorded: 2017-12-27 Pages: 6
Assignors
ADUSUMILLI, PRANEET
Executed: 2017-02-10
MANISCALCO, JOSEPH F.
Executed: 2017-02-07
REZNICEK, ALEXANDER
Executed: 2017-02-08
VAN DER STRATEN, OSCAR
Executed: 2017-02-07
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Low Resistance Seed Enhancement Spacers for Voidless Interconnect Structures
Application: 15/855,686 →
Publication: US 2018/0233445
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 13, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052644/0868 →