Patent Assignment
Reel/Frame 044493/0863
Assignment of Assignor's Interest
Recorded: 2017-12-27
Pages: 4
Assignors
CHO, KILWON
Executed: 2017-12-22
CHUNG, YOONYOUNG
Executed: 2017-12-11
KIM, HYUN HO
Executed: 2017-12-05
Assignee
CENTER FOR ADVANCED SOFT ELECTRONICS
POSTECH, 77, CHEONGAM-RO, NAM-GU, GYEONGSANGBUK-DO, POHANG-SI, 37673, KOREA, REPUBLIC OF
Covered Property
(1)
Flexible Substrate Lamination Body for Reducing Surface Strain and Flexible Electronic Device Comprising Same
Application:
15/740,313 →
Publication:
US 2018/0190762
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.