IP Library › Patent Application 15740313
Patent Application
App. No. 15/740,313

FLEXIBLE SUBSTRATE LAMINATION BODY FOR REDUCING SURFACE STRAIN AND FLEXIBLE ELECTRONIC DEVICE COMPRISING SAME

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Quick Facts
Patent No.
US None
App. No.
15/740,313
Abstract

Disclosed is a flexible substrate laminate including a flexible substrate and a base member configured to reduce strain of the flexible substrate on one surface of the flexible substrate. The flexible substrate laminate includes the base member for reducing surface strain to thus decrease the surface shear stress and surface strain thereof, thereby minimizing deterioration in the performance of a device. When the flexible substrate laminate is applied to various electronic devices, the electronic devices can exhibit improved bending resistance while the performance thereof is prevented from decreasing even after bending.

Claims (24)

1 . A flexible substrate laminate, comprising:

a flexible substrate; and

a base member configured to reduce strain of the flexible substrate on one surface of the flexible substrate.

2 . The flexible substrate laminate of claim 1 , wherein a shear modulus (G 1 ) of the flexible substrate is greater than a shear modulus (G 2 ) of the base member.

3 . The flexible substrate laminate of claim 2 , wherein a ratio (G 1 /G 2 ) of the shear modulus (G 1 ) of the flexible substrate and the shear modulus (G 2 ) of the base member satisfies Formula 1 below.

1< G 1 /G 2 ≤10 4   [Formula 1]

4 . The flexible substrate laminate of claim 2 , wherein, in the flexible substrate laminate subjected to bending, a surface strain (γ 2 ) of the base member is greater than a surface strain (γ 1 ) of the flexible substrate.

5 . The flexible substrate laminate of claim 4 , wherein, in the flexible substrate laminate subjected to bending, a ratio (γ 2 /γ 1 ) of the surface strain (γ 2 ) of the base member and the surface strain (γ 1 ) of the flexible substrate satisfies Formula 2 below.

1<γ 2 /γ 1 ≤10 3   [Formula 2]

6 . The flexible substrate laminate of claim 1 , wherein the flexible substrate includes a polymer.

7 . The flexible substrate laminate of claim 6 , wherein the polymer is at least one selected from among polytetrafluoroethylene, polyimide, polyamide, polyester, polyethylene, polypropylene, polyester, polyurethane, polydimethylsiloxane, polyacrylate, polyarylate, fiber-reinforced plastic, and combinations thereof.

8 . The flexible substrate laminate of claim 1 , wherein the base member includes an adhesive.

9 . The flexible substrate laminate of claim 8 , wherein the adhesive includes at least one selected from among silicone, polyurethane, an acrylic resin, an epoxy resin, and polyimide.

10 . A flexible electronic device, comprising a flexible substrate laminate including a flexible substrate and a base member configured to reduce strain of the flexible substrate on one surface of the flexible substrate.

11 . The flexible electronic device of claim 10 , wherein the flexible substrate laminate is an adhesive tape, and

the flexible electronic device is transferred onto another substrate using the adhesive tape and is attached thereto.

12 . The flexible electronic device of claim 10 , wherein the flexible electronic device is any one selected from among a transistor, a solar cell, an organic light-emitting diode, a tactile sensor, a radio-frequency identification tag, e-paper, and a biosensor.

13 . The flexible electronic device of claim 12 , wherein the flexible electronic device is a transistor,

the transistor comprising:

a flexible substrate laminate including a flexible substrate and a base member configured to reduce strain of the flexible substrate on one surface of the flexible substrate;

a gate electrode on the flexible substrate laminate;

a gate insulating layer on the gate electrode;

a source electrode and a drain electrode on the gate insulating layer; and

an active layer between the source electrode and the drain electrode.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2018
From: CENTER FOR ADVANCED SOFT ELECTRONICS
To: CENTER FOR ADVANCED SOFT ELECTRONICS; POSTECH ACADEMY-INDUSTRY FOUNDATION
Reel/Frame 046658/0580 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 27, 2017
From: CHO, KILWON; CHUNG, YOONYOUNG; KIM, HYUN HO
To: CENTER FOR ADVANCED SOFT ELECTRONICS
Reel/Frame 044493/0863 →