Patent Assignment
Reel/Frame 044498/0163
Assignment of Assignor's Interest
Recorded: 2017-12-28
Pages: 3
Assignors
FU, HUILI
Executed: 2017-12-26
CAI, SHUJIE
Executed: 2017-12-26
HU, XIAO
Executed: 2017-12-26
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, 518129, CHINA
Covered Property
(1)
A Chip Package Structure Having a Heat Dissipation Apparatus with Alternating Multiple Insulation and Thermally Conductive Layers