Chip package structure and manufacturing method thereof
A chip package structure, including a substrate, multiple chips and multiple discrete devices that are packaged on an upper surface of the substrate, and a heat dissipation apparatus, where the heat dissipation apparatus includes an insulation layer and a thermally conductive layer that are laminated. The insulation layer completely encloses and adheres to outer surfaces of the multiple chips, outer surfaces of the multiple discrete devices, and the upper surface of the substrate and configured to conduct heat generated by the multiple chips and the multiple discrete devices to the thermally conductive layer and the substrate such that the heat generated by the multiple chips and the multiple discrete devices dissipated using the thermally conductive layer and the substrate.
1. A chip package structure, comprising:
a substrate;
a chip and a discrete device that are packaged on an upper surface of the substrate; and
a heat dissipation apparatus comprising a plurality of layers, wherein the plurality of layers comprises a plurality of insulation layers and a plurality of thermally conductive layers that are alternately laminated,
wherein a lowest layer of the plurality of layers is an insulating layer that completely encloses outer surfaces of the chip, an outer surface of the discrete device, and the upper surface of the substrate, and
wherein a highest layer of the plurality of layers is a thermally conductive layer.
2. The chip package structure of claim 1 , wherein the plurality of thermally conductive layers comprises a thermally conductive material and a formable insulating material.
3. The chip package structure of claim 2 , wherein the thermally conductive material is evenly doped with the formable insulating material.
4. The chip package structure of claim 2 , wherein the thermally conductive material comprises graphene.
5. The chip package structure of claim 2 , wherein the thermally conductive material comprises a graphite sheet.
6. The chip package structure of claim 2 , wherein the thermally conductive material comprises a boron nitride sheet.
7. The chip package structure of claim 2 , wherein the thermally conductive material comprises graphene and a boron nitride sheet.
8. The chip package structure of claim 2 , wherein the thermally conductive material comprises a graphite sheet and a boron nitride sheet.
9. The chip package structure of claim 2 , wherein the formable insulating material comprises an epoxy resin.
10. The chip package structure of claim 2 , wherein the formable insulating material comprises a polyimide.
11. The chip package structure of claim 2 , wherein the formable insulating material comprises an epoxy resin and a polyimide.
12. The chip package structure of claim 1 , wherein the plurality of insulation layers and the plurality of thermally conductive layers that are laminated coincide in a projection direction that is perpendicular to the upper surface of the substrate.
13. The chip package structure of claim 1 , wherein the plurality of insulation layers is configured to conduct the heat generated by the chip and the discrete device to air such that the heat generated by the chip and the discrete device are directly dissipated using the plurality of insulation layers.
14. The chip package structure of claim 1 , wherein the plurality of insulation layers comprises a formable insulating material.
15. The chip package structure of claim 1 , further comprising a plurality of solder balls disposed in an array on a lower surface of the substrate.
16. The chip package structure of claim 1 , wherein an inner surface of a thermally conductive layer of the plurality of thermally conductive layers that contacts an insulation layer of the plurality of insulation layers is contorted about the outer surfaces of the chip, the outer surfaces of the discrete device, and the upper surface of the substrate, and wherein an outer surface of the highest layer that is away from the insulation layer is planar.