IP Library › Assignment 044499/0973
Patent Assignment
Reel/Frame 044499/0973

Assignment of Assignor's Interest

Recorded: 2017-12-28 Pages: 4
Assignors
PARK, SE HUN
Executed: 2017-12-14
JI, GU WON
Executed: 2017-12-14
PARK, HEUNG KIL
Executed: 2017-12-14
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multilayer Electronic Component and Board Having the Same
Application: 15/856,590 →
Publication: US 2019/0103221