Patent Assignment
Reel/Frame 044508/0642
Assignment of Assignor's Interest
Recorded: 2017-12-29
Pages: 5
Assignors
HELLMUND, OLIVER
Executed: 2017-11-30
BAUMGARTL, JOHANNES
Executed: 2017-11-23
MODER, IRIS
Executed: 2017-11-24
MURI, INGO
Executed: 2017-11-24
NEIDHART, THOMAS CHRISTIAN
Executed: 2017-11-23
SCHULZE, HANS-JOACHIM
Executed: 2017-11-23
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Method of Wafer Thinning and Realizing Backside Metal Structures