Method of wafer thinning and realizing backside metal structures
In accordance with an embodiment of the present invention, a method of fabricating a semiconductor device includes forming openings partially filled with a sacrificial material, where the openings extend into a semiconductor substrate from a first side. A void region is formed in a central region of the openings. An epitaxial layer is formed over the first side of the semiconductor substrate and the openings, where the epitaxial layer covers the void region. From a second side of the semiconductor substrate opposite to the first side, the semiconductor substrate is thinned to expose the sacrificial material. The sacrificial material in the openings is removed and the epitaxial layer is exposed. A conductive material is deposited on the exposed surface of the epitaxial layer.
1. A method of fabricating a semiconductor device, the method comprising:
forming openings partially filled with a sacrificial material, the openings extending into a semiconductor substrate from a first side;
forming a void region in a central region of the openings;
forming an epitaxial layer over the first side of the semiconductor substrate and the openings, the epitaxial layer covering the void region;
from a second side of the semiconductor substrate opposite to the first side, thinning the semiconductor substrate to expose the sacrificial material;
removing the sacrificial material in the openings;
exposing the epitaxial layer; and
depositing a conductive material on the exposed surface of the epitaxial layer.
2. The method of claim 1 , further comprising forming a device region in the epitaxial layer.
3. The method of claim 2 , wherein the device region comprises a trench gate device, and wherein a trench gate of the trench gate device is disposed over one of the openings.
4. The method of claim 2 , wherein the device region comprises a source region of a transistor.
5. The method of claim 4 , wherein the transistor is a vertical MOSFET, and wherein the conductive material forms a back side contact to the vertical MOSFET.
6. The method of claim 1 , wherein a surface of the sacrificial material that is exposed is substantially planar.
7. The method of claim 1 , wherein thinning the semiconductor substrate comprises a chemical mechanical planarization process.
8. The method of claim 1 , wherein thinning the semiconductor substrate comprises an anisotropic wet etching process.
9. The method of claim 8 , wherein the anisotropic wet etching process comprises a tetramethylammonium hydroxide (TMAH) or potassium hydroxide (KOH) etchant.
10. The method of claim 1 , wherein the each of the openings comprise a plurality of sidewalls and a bottom surface, and wherein forming the openings comprises:
forming a liner over a major surface of the semiconductor substrate, the sidewalls of the openings, and the bottom surface of each of the openings; and
forming a fill material over the liner.
11. The method of claim 1 , wherein the sacrificial material comprises at least one of a thermal oxide, a CVD oxide, a nitride, amorphous carbon, and graphite, wherein the conductive material comprises at least one of a metal, a ternary carbide, and a ternary nitride.
12. The method of claim 1 , wherein the semiconductor device is a vertical device, wherein the conductive material forms a back side contact to the semiconductor device.
13. The method of claim 1 , wherein forming the epitaxial layer comprises growing the epitaxial layer starting from the first side of the semiconductor substrate, the epitaxial layer laterally growing over the openings and the void region.
14. The method of claim 1 , wherein forming the openings comprises:
forming the openings in the semiconductor substrate from the first side;
oxidizing the openings to form an oxide liner; and
depositing a fill material using a chemical vapor deposition process, wherein the sacrificial material comprises the oxide liner and the fill material.
15. A method of fabricating a semiconductor device, the method comprising:
forming openings extending into a semiconductor substrate from a first side;
filling the openings partially with a sacrificial material, the sacrificial material forming a void region that extends from the sacrificial material to a top edge of the openings by surrounding the void region from three side walls of the openings;
forming an epitaxial layer over the first side of the semiconductor substrate and the openings, the epitaxial layer covering the void region at the top edge of the openings; from a second side of the semiconductor substrate opposite to the first side, thinning the semiconductor substrate to expose the sacrificial material.
16. The method of claim 15 , wherein the sacrificial material in the openings is removed to expose the epitaxial layer.
17. The method of claim 16 , wherein a conductive material is deposited on the exposed surface of the epitaxial layer.
18. The method of claim 15 , wherein forming the openings comprises:
forming the openings in the semiconductor substrate from the first side;
oxidizing the openings to form an oxide liner; and
depositing a fill material using a chemical vapor deposition process.
19. The method of claim 15 , wherein the sacrificial material comprises at least one of a thermal oxide, a CVD oxide, a nitride, amorphous carbon, and graphite, wherein the conductive material comprises at least one of a metal, a ternary carbide, and a ternary nitride.
20. A method of fabricating a semiconductor device, the method comprising:
forming openings extending into a semiconductor substrate from a first side;
filling the openings partially with a sacrificial material, the sacrificial material forming avoid region that extends from the sacrificial material to a top edge of the openings;
forming an epitaxial layer over the first side of the semiconductor substrate and the openings, the epitaxial layer sealing the void region;
from a second side of the semiconductor substrate opposite to the first side, thinning the semiconductor substrate to expose the sacrificial material;
removing the sacrificial material in the openings to expose the epitaxial layer;
removing the semiconductor substrate and forming a rough exposed surface in the epitaxial layer
depositing a conductive material on the rough exposed surface of the epitaxial layer.
21. The method of claim 18 , wherein forming the openings comprises:
forming the openings in the semiconductor substrate from the first side;
oxidizing the openings to form an oxide liner; and
depositing a fill material using a chemical vapor deposition process.
22. The method of claim 18 , wherein the sacrificial material comprises at least one of a thermal oxide, a CVD oxide, a nitride, amorphous carbon, and graphite, wherein the conductive material comprises at least one of a metal, a ternary carbide, and a ternary nitride.