Patent Assignment
Reel/Frame 044563/0744
Assignment of Assignor's Interest
Recorded: 2018-01-08
Pages: 7
Assignors
LEE, JAE UNG
Executed: 2017-12-26
LEE, YUNG WOO
Executed: 2017-01-04
CHOI, MI KYEONG
Executed: 2017-12-26
KIM, JIN SEONG
Executed: 2017-12-18
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.