Patent Assignment
Reel/Frame 044566/0106
Assignment of Assignor's Interest
Recorded: 2018-01-08
Pages: 3
Assignor
CHEN, YI
Executed: 2017-12-13
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same