Patent Assignment
Reel/Frame 044566/0109
Assignment of Assignor's Interest
Recorded: 2018-01-08
Pages: 4
Assignors
CHEN, SHAO-AN
Executed: 2017-12-25
LU, PO-WEI
Executed: 2017-12-25
SHEN, MING TSUNG
Executed: 2017-12-25
PENG, YU-TZU
Executed: 2017-12-25
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Molding for Large Panel Fan-Out Package